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| data sheet Features: LEADFRAME LQFP PowerQuad(R) 4 High-performance operation and attributes of the LQFP PowerQuad(R) 4 include the following: * High conductive, solid exposed heatsink * 1.4 mm body for lightweight, portable applications * 50% reduction in package self-inductance * 50% improvement in Ja over standard MQFP * 44 to 128 lead counts * 10 x 10 - 14 x 14 mm body sizes (JEDEC standard packages MS-026) * Heatsink-up and down configurations available LQFP PowerQuad(R) 4 Packages: LQFP PowerQuad(R) 4 (PQ4) is the same Amkor patented, advanced IC packaging technology used in MQFP PQ4s but applied to Low Profile 1.4 mm QFPs (LQFP). Improved power dissipation is achieved by using an exposed copper heatslug. This large copper heat slug extracts generated heat from the leadframe to which the IC is attached. Thermal resistance improvements of approximately 30% (over a standard LQFP) can be realized with this IC package without the use of any external cooling aids! In addition, the patented LQFP PQ4 heatsink has integrated mechanical "locking" features to ensure total package integrity and eliminates moisture penetration. The end result is a high-power, high-speed IC package with the properties to enable new, smaller, denser, portable electronic products and emerging end applications to operate with more features and greater reliability. Applications: Major semiconductor manufacturers and packaging engineers have chosen LQFP PQ4 as the IC package of choice for power microprocessors, controllers, DSPs, high speed logic/FPGAs, PLDs, ASICs and other advanced technologies. System designers and OEM product developers find the LQFP PQ4 solves power, thermal and speed concerns while supporting system constraints (standard package outlines, cost, SMT capability, product availability, technical support) in uses such as: laptops, notebooks, telecom, cordless/wireless, highend audio/video, CPU/GUI board systems and many other small form-factor applications. Thermal Resistance: Multi-Layer PCB Theta JA (C/W) by Velocity (LFPM) Pkg Body Size Pad Size 64 ld 10 x 10 7.5 100 Id 14 x 14 9.5 Pre-JEDEC Standard Test Boards 0 34.8 23.2 200 28.9 12.8 500 26.4 15.8 Reliability: Advanced design, manufacturing processes and materials assure long-term reliable performance. * Temp cycle * Thermal shock (liq) * Autoclave * Temp/Humidity * High temp storage -65/+150 C, 1000 cycles -65/+150 C, 1000 cycles 121 C, 2 atm, 168 hours 85 C/85%RH, 1000 hours 150 C, 1000 hours VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND TO VIEW THE MOST CURRENT PRODUCT INFORMATION. www.amkor.com DS576B Rev Date: 05`06 data sheet Cross-sections LQFP PowerQuad(R) 4 LEADFRAME LQFP PowerQuad(R) 4 Process Highlights Die thickness (max) 15.0 mils Strip solder plating 85/15 Sn/Pb Strip marking Pad Lead inspection Laser/optical Pack/ship options Bar code/dry pack/TNR Test Services * Program generation/conversion * Product engineering * Wafer sort * 256 Pin x 20 MHz test system available * -55 C to +165 C test available * Burn-in Shipping Low profile tray (JEDEC Outline CS-007) Inverted Configuration Options: LOW PROFILE POWERQUAD(R) 4 PACKAGE FAMILY (units in mm) Lead Count 44 44 64 64 80 100 120 128 Body Size 10 x 10 14 x 14 10 x 10 14 x 14 14 x 14 14 x 14 14 x 14 14 x 14 Body Thickness 1.4 1.4 1.4 1.4 1.4 1.4 1.4 1.4 Lead Pitch 0.80 1.0 0.50 0.80 0.65 0.50 0.40 0.40 Form Length 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 Tip To Tip 12.0 x 12.0 16.0 x 16.0 12.0 x 12.0 16.0 x 16.0 16.0 x 16.0 16.0 x 16.0 16.0 x 16.0 16.0 x 16.0 Foot Length 0.60 0.60 0.60 0.60 0.60 0.60 0.60 0.60 Board JEDEC Standoff Package 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 MS-026 MS-026 MS-026 MS-026 MS-026 MS-026 MS-026 MS-026 Tray Matrix 8 x 20 6 x 15 8 x 20 6 x 15 6 x 15 6 x 15 6 x 15 6 x 15 Units Per Tray 240 90 240 90 90 90 90 90 www.amkor.com With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor's warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice. |
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